AMD unveiled the Ryzen AI 300 Series, a new line of processors designed for elite ultrathin laptops and optimized for AI workloads. These processors feature up to 12 high-performance Zen 5 cores and 24 threads, with models such as the Ryzen AI 9 HX 370 and Ryzen AI 9 365 offering 12C/24T and 10C/20T configurations, respectively. The Ryzen AI 300 Series is equipped with AMD’s XDNA 2 Neural Processing Unit (NPU), which provides 50 TOPS (Tera Operations Per Second) of AI processing power. Additionally, these processors include integrated graphics based on the RDNA 3.5 architecture and are designed to maintain exceptional power efficiency, with a cTDP range of 15-54W, making them suitable for ultrathin laptops.
AMD also announced the Ryzen 9000 Series desktop processors, which are set to launch in July 2024. These processors are based on the Zen 5 microarchitecture, known as “Granite Ridge,” and are manufactured on TSMC’s N4 node. The series includes four models: Ryzen 9 9950X, Ryzen 9 9900X, Ryzen 7 9700X, and Ryzen 5 9600X. The flagship Ryzen 9 9950X boasts 16 cores, 32 threads, 80MB of combined L2/L3 cache, and base/boost clocks of 4.3 GHz and 5.7 GHz, respectively, with a TDP of 170 watts.
AMD also detailed its roadmap for the 5th Gen EPYC processors (codenamed “Turin”) and the Instinct MI325X accelerators. The EPYC Turin processors will feature up to 192 cores and 384 threads and are expected to launch in the second half of 2024. The Instinct MI325X accelerators, with 288GB of ultra-fast HBM3E memory, are planned for availability in Q4 2024.
AMD introduced two new chipsets, the AMD Socket AM5 X870 and Socket AM5 X870E, which are compatible with Ryzen processors from the 7000 to 9000 series. These chipsets support USB 4.0 and PCIe Gen 5, offering higher EXPO overclock support.
